Product Features
Exceptional Thermal Resistance
Excellent Mechanical Properties
High Impact Strength and Durability
Suitable for Engineering Purpose
Comes with High Temperature Reusable Spool
Diameter: 1.75mm +/- 0.03mm

Cautions for Use
Dry out before use
AMS Compatible
Enclosure Printers Required
 
Accessory Compatibility
 
Recommended
Not Recommended
Build Plate
Engineering Plate, High Temperature Plate or Textured PEI Plate
Cool Plate
Hotend
All Size / Material
/
Glue
Glue Stick
Bambu Liquid Glue
 
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
 
Printing Tips:
• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed.